LB2518B1R0M [TAIYO YUDEN]
General Purpose Inductor, 1uH, 20%, 1 Element, Ferrite-Core, SMD, 1007;型号: | LB2518B1R0M |
厂家: | TAIYO YUDEN (U.S.A.), INC |
描述: | General Purpose Inductor, 1uH, 20%, 1 Element, Ferrite-Core, SMD, 1007 |
文件: | 总14页 (文件大小:507K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
巻線チップインダクタ
WOUND CHIP INDUCTORS
LB SERIES
OPERATING TEMP.
K25VJ85C
特長ꢀFEATURES
Y超小型 、低直
流抵抗の巻線チップインダクタ
Y実装性、特性において方向性のない形状
YSmall size wound chip inductor with low DC resistance.
YDemension without directional influence on mounterbility and characteris-
tics.
用途ꢀAPPLICATIONS
YDVC, MD, PDA等の携帯AV機器,ディジタル機器
YDVC, MD, PDA and other portable digital equipment.
形名表記法ꢀORDERING CODE
3
1
5
6
外径寸法 hmmi
インダクタンス許容差 hLi
形式
LB
公称インダクタンス hAHi
例
1608(0603)
1.6P0.8
巻線チップインダクタ
M
M20
2016(0806)
2.0P1.6
1R0
100
101
1
2012(0805)
2518(1007)
2.0P1.25
2.5P1.8
10
100
FRW 小数点
2
7
4
形状
当社管理記号
QQQ
包装
B
Q
低 Rdc
標準品
単品
C
大電流
T
テーピング
QW スペース
2 0 1 6 T 1 0 0 M
L B △
△△△△
4
5
1
2
3
6
7
1
5
6
3
Inductance Tolerances h%i
Type
LB
External Dimensions hmmi
Nominal InductancehAHi
example
Wound chip inductor
M
M20
1608(0603)
2016(0806)
2012(0805)
2518(1007)
1.6P0.8
2.0P1.6
2.0P1.25
2.5P1.8
1R0
100
101
1
10
100
*R=decimal point
2
4
7
Packaging
Shape
Internal code
B
Bulk
QQQ
Standard Products
Q
Low Rdc
T
Tape & Reel
C
High current Type
QWBlank space
190
外形寸法ꢀEXTERNAL DIMENSIONS
Type
L
W
T
E
2.5M0.2
(0.098M0.008)
2.0M0.2
1.8M0.2
(0.071M0.008)
1.6M0.2
1.8M0.2
(0.071M0.008)
1.6M0.2
0.5M0.2
(0.020M0.012)
0.5M0.2
LB2518/
LBC2518
LB2016
LB2012
LB1608
(0.079M0.008)
2.0M0.2
(0.063M0.008)
1.25M0.2
(0.063M0.008)
1.25M0.2
(0.020M0.012)
0.5M0.2
(0.079M0.008)
1.6M0.1
(0.049M0.008)
0.8M0.1
(0.049M0.008)
0.8M0.1
(0.020M0.012)
0.35M0.2
(0.063M0.008)
(0.031M0.004)
(0.031M0.004)
(0.014M0.010)
5
UnitDmmfinchg
概略バリエーションꢀAVAILABLE INDUCTANCE RANGE
Type
LB2518
LB2016
LBC2518
LB2012
LB1608
Range
RdcM30L[E]
RdcM30L[E]
RdcM30L[E]
RdcM30L[E]
RdcM30L[E]
Imax[mA]
Imax[mA]
Imax[mA]
Imax[mA]
Imax[mA]
E E E E 1AHE E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E
1AH
1AH
4.7AH
1.0AH
500
455
300
70
775
0.06
0.09
0.15
0.55
0.08
1
165
0.25
155
0.5
100
0.7
50
0.7
300
0.36
10
8.2AH
55
2.1
40
4.5
30
7.0
100
3.70
100
E E E E E E E E E E E E1E00EAEHE E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E
100AH
15
24
35
28.0
1000 E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E
1000AH 680AH
Inductance
Ima[x mA] RdcM30%[E] Ima[x mA] RdcM30%[E] Ima[x mA] RdcM30%[E] Ima[x mA] RdcM30%[E] Ima[x mA] RdcM30%[E]
1AH
10AH
500
165
55
0.06
0.25
2.1
455
155
40
0.09
0.5
4.5
-
300
100
30
0.15
0.7
7.0
-
70(4.7AH) 0.55(4.7AH)
50(8.2AH) 0.70(8.2AH)
775
300
100
-
0.08
0.36
3.70
-
100AH
1000AH
-
-
-
-
15
24
-
-
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
P.198
P.10
etc
P.192
P.193
P.197
P.214
191
アイテム一覧ꢀPART NUMBERS
LB1608 TYPE
公称
インダクタンス
許容差
直流抵抗 電流 ꢀ
Rated
形ꢀꢀ名
Q
値
Typical Value
数
Self-resonant
frequency
hMHzi
DC
数
インダクタンス
Inductance
hAHi
Resistance
hEi
fM30Lg
current
hmAi
max.
Measuring
frequency
hMHzi
Inductance
Tolerance
Ordering code
min.
LB1608G4R7M
4.7
45
32
0.55
0.70
70
50
7.96
2.52
20L
5
LB1608G8R2M
8.2
Y注D形名のGに 包装記号
YG Please specify the packaging code.fTDTape&Reel, BDBulkg
LB2012 TYPE
形ꢀꢀ名
公称
インダクタンス
インダクタンス
許容差
直流抵抗 電流 ꢀ
Rated
Q
値
Typical Value
数
Self-resonant
frequency
hMHzi
DC
数
Resistance
hEi
fM30Lg
current
hmAi
max.
Measuring
frequency
hMHzi
Inductance
hAHi
1.0
Inductance
Tolerance
Ordering code
min.
LB2012G1R0M
LB2012G2R2M
100
80
45
32
32
16
11
8
0.15
0.23
0.4
300
240
140
100
100
75
2.2
5
7.96
LB2012G4R7M
4.7
LB2012G100M
10
0.7
0.5
1.7
3.7
7.0
M20L
LB2012G100MR
LB2012G220M
10
2.52
22
10
LB2012G470M
47
50
LB2012G101M
100
30
0.796
Y注D形名のGに 包装記号
、
YG Please specify the packaging code.fTDTape&Reel, BDBulkg
K公差品
い
LB2016 TYPE
公称
インダクタンス
Inductance
hAHi
1
インダクタンス
許容差
Inductance
Tolerance
直流抵抗 電流 ꢀ
数
形ꢀꢀ名
Q
値
Typical Value
数
Self-resonant
frequency
hMHzi
DC
Rated
Resistance
hEi
fM30Lg
current
hmAi
max.
Measuring
frequency
hMHzi
Ordering code
min.
LB2016G1R0M
LB2016G1R5M
LB2016G2R2M
LB2016G3R3M
LB2016G4R7M
LB2016G6R8M
LB2016G100M
LB2016G150M
LB2016G220M
LB2016G330M
LB2016G470M
LB2016G680M
LB2016G101M
100
80
70
55
45
38
32
28
16
14
11
10
8
0.09
0.11
0.13
0.2
455
350
315
280
210
175
155
130
105
85
1.5
2.2
7.96
3.3
4.7
0.25
0.35
0.5
6.8
10
M20L
10
15
0.7
22
1.0
2.52
33
1.7
47
2.4
60
68
3
50
100
4.5
40
0.796
Y注D形名のGに 包装記号
、
YG Please specify the packaging code.fTDTape&Reel, BDBulkg
K公差品
い
LB2518 TYPE
公称
インダクタンス
Inductance
hAHi
1
インダクタンス
許容差
直流抵抗 電流 ꢀ
Rated
形ꢀꢀ名
Q
値
Typical Value
数
Self-resonant
frequency
hMHzi
DC
数
Resistance
hEi
fM30Lg
current
hmAi
max.
Measuring
frequency
hMHzi
Inductance
Tolerance
Ordering code
min.
LB2518G1R0M
LB2518G1R5M
LB2518G2R2M
LB2518G3R3M
LB2518G4R7M
LB2518G6R8M
LB2518G100M
LB2518G150M
LB2518G220M
LB2518G330M
LB2518G470M
LB2518G680M
LB2518G101M
LB2518G151M
LB2518G221M
LB2518G331M
LB2518G471M
LB2518G681M
LB2518G102M
100
80
68
54
46
38
30
23
19
15
12
9.5
9
0.06
0.07
0.09
0.11
0.13
0.15
0.25
0.32
0.5
500
400
340
270
240
195
165
145
115
95
1.5
2.2
7.96
2.52
3.3
4.7
6.8
10
15
22
M20L
10
33
0.7
47
0.95
1.5
85
68
70
100
2.1
55
150
7
3.2
45
220
330
5.5
4.5
3.5
3
4.5
7
35
30
0.796
0.252
470
10
25
680
17
20
1000
2.4
24
15
Y注D形名のGに 包装記号
、
YG Please specify the packaging code.fTDTape&Reel, BDBulkg
K公差品
い
LBC2518TYPE
公称
インダクタンス
Inductance
hAHi
1.0
インダクタンス
許容差
Inductance
Tolerance
直流抵抗 電流 ꢀ
形ꢀꢀ名
Q
値
Typical Value
数
Self-resonant
frequency
hMHzi
DC
Resistance
hEi
fM30Lg
0.08
Rated
数
current
hmAi
max.
775
Measuring
frequency
hMHzi
Ordering code
min.
100
LBC2518G1R0M
LBC2518G1R5M
LBC2518G2R2M
LBC2518G3R3M
LBC2518G4R7M
LBC2518G6R8M
LBC2518G100M
LBC2518G150M
LBC2518G220M
LBC2518G330M
LBC2518G470M
LBC2518G680M
LBC2518G101M
LBC2518G151M
LBC2518G221M
LBC2518G331M
LBC2518G471M
LBC2518G681M
1.5
80
0.11
0.13
0.16
0.20
0.30
0.36
0.65
0.77
1.50
1.90
2.80
3.70
6.10
8.40
12.3
22.0
28.0
660
600
500
430
360
300
250
210
170
150
120
100
85
2.2
68
7.96
2.52
3.3
54
4.7
41
6.8
38
10
30
15
23
22
19
M20L
5
33
15
47
12
68
9.5
9.0
7.0
5.5
4.5
3.5
3.0
100
150
220
70
0.796
330
60
470
45
680
35
Y注D形名のGに 包装記号
YG Please specify the packaging code.fTDTape&Reel, BDBulkg
192
特性図ꢀELECTRICAL CHARACTERISTICS
直
流
特性例 DC Bias characteristics (Measured by HP4285A+42841A)
LB2012
LB2016
LB1608
1000
1000
1000
101M
101K
100K
100
10
100
10
100
10
100M
8R2M
4R7M
1R0M
1000
1R0M
1000
1
1
1
5
0.1
10
0.1
10
0.1
1
100
10000
100
10000
10
100
1000
LB2518
LBC2518
1000
1000
101M
101M
100
10
100
10
100M
100M
1R0M
1R0M
1
1
0.1
1
0.1
1
10
100
1000
10
100
1000
10000
特性例 Temperature characteristics (Measured by HP4285A)
LB1608
LB2012
LB2016
15
15
10
5
100M
10
5
101M
1R0M
8R2M
100M
101M
1R0M
0
5
0
5
10
10
15
15
-30
-10
10
30
50
70
90
LB2518
LBC2518
15
10
5
15
10
5
100M
101M
1R0M
0
5
0
5
100M
101M
1R0M
10
15
10
15
-40
-
20
0
20
40
60
80 100
193
PRECAUTIONS
LER Type,LEM Type,LB Type
Stages
Precautions
Technical considerations
1.Circuit Design
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
5
2.PCB Design
Land pattern design
1.Please contact any of our offices for a land pattern, and refer
to a recommended land pattern of specifications.
Adjustment of mounting machine
3.Considerations for
automatic placement
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may
deform the products.
4.Soldering
Wave soldering
1.Please refer to the specifications in the catalog for a wave
soldering.
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
2.LER012 Type,LB Type
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
Reflow solderring only.
Lead free soldering
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, etc. sufficiently.
Recommended conditions for using a soldering iron
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Cleaning conditions
5.Cleaning
6.Handling
LB Type
LB Type
1.Washing by supersonic waves shall be avoided.
Handling
1.If washing by supersonic waves, supersonic waves may cause broken products.
1.Keep the inductors away from all magnets and magnetic
objects.
1.There is a case that a characteristic varies with magnetic influence.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting inductors, care
should be taken not to give any stresses of deflection or
twisting to the board.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.Please do not give the inductors any excessive mechanical
shocks.
1.There is a case to be damaged by a mechanical shock.
7.Storage conditions
Storage
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled.
Recommended conditions
1. Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration
of taping/packaging materials may take place.
ꢀAmbient temperatureꢀꢀꢀꢀꢀ 0 40
ꢀHumidity
Below 70% RH
The ambient temperature must be kept below 30 Even under
ideal storage conditions, solderability of products electrodes may
decrease as time passes. For this reason, LE type inductors
should be used within one year from the time of delivery.
LER type, LB type
Please should be used within 6 months from the time of delivery.
LE type
In case of storage over
6 months, solderability shall be
checked before actual usage.
215
1/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
1.Operating tem-
perature Range
2.Storage
K40VJ85C
K25VJ85C
K25VJ85C
K40VJ85C
K25VJ85C
3.Rated Voltage
Within the specified tolerance
The maximum DC value having inductance
decrease within 10L and temperature
increas within 20C by the application of DC
bias.
5
LBH1608 LEM Series 5N6VR10:
The maximum DC value having temperature
increas within 20C by the application of DC
bias.
4.Inductance
LER LEM Series 5N6VR10
Within the specified tolerance
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
Measuring frequency Specified frequency
LER LEM Series R12V221
Measuring equipment LCR Meter
fHP4285A 42851A or its equivalentg
Measuring frequency Specified frequency
LB LBC Series
Measuring equipment LCR Mater
fHP4285A or its equivalentg
LBH1608 Series
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
12V18
fat 100MHzg
min
5.Q
LER LEM Series 5N6VR10
Within the specified tolerance
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
Measuring frequency Specified frequency
LER LEM Series R12V221
Measuring equipment LCR Meter
fHP4285A 42851A or its equivalentg
Measuring frequency Specified frequency
LB LBC Series
Measuring equipment LCR Mater
fHP4285A or its equivalentg
LBH1608 Series
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
6.DC Resisitance
Within the specified tolerance
LER LEM LB LBC LBH Series
Measuring equipment low ohmmeter
fA&D AD5812 or its equivalentg
199
2/8
RELIABILITY DATAꢀꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
7.Self-Resonant Within the specified tolerance
Frequency
LER LEM Series
5N6VR10
Measuring equipment Network analyzer
fHP8720B or its equivalentg
LER LEM Series fExclude LEM2520g
R12V
Measuring equipment Impeadnce nanlyzer
fHP4291A or its equivalentg
5
LEM2520
Measuring equipment Network analyzer
fAnritsu MS620J or its equivalentg
LB LBC Series
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
LBH1608 Series
Measuring equipment Network analyzer
fHP8720B or its equivalentg
8.Temperature Char- △L/L WithinM5L
QL/LC
Within
M10L
QL/LC
Within
M5L
QL/LCWithinM15L
QL/LCWithinM15L
QL/LC
Change of maximum inductance deviation
acteristic
WithinM5L
△L/LC
in step 1K5
WithinM0.5nH
under 8.2nH
Exclude CM03MS series
Step
Temperture fCg
1
2
3
4
5
20
K25
20 fReference temperatureg
J85 fMaximum operating temperatureg
20
Warp: 2mm (LER012, LER015, LBC, LB)
: 3mm (LEM2520, LEMC2520, LEMF
2520, LEMC3225, LEMF3225)
Test substrate: Printed board
9.Rasistance to Flex- No breakdown or damage
ure of Substrate
Accoding to JIS C0051
Pressig jig
Board
10.Body Stregght
No breakdown or damage
LER012 LER015
Applide forde 15N
Duration 5sec.
LBYLBCYLBH
LEM2520 LEMC2520 LEMF2520
LEMC3225 LEMF3225
Applide forde 10N
Duration 10sec.
LB1608
Applide forde 5N
Duration 10sec.
11. Self Resonant
Freguency
△L/L WithinK10L
Measure inductance with application of rated
current using LCR metre to cpmpare it with
the initial value. f* Excluding 5N6VR10g
201
3/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
Shall not come off PC board.
12.Adhesion of terminal Shall not come off No detachment of electrode
LER012YLER015
electrode
PC board.
Applied force 15N
Duration 5 sec.
Test substrate Printed board
LBYLBCYLBH
LEM2520YLEMC2520YLEMF2520Y
LEMC3225YLEMF3225
5
Applied force 10N to X and Y directions
Duration 5 sec.
Test substrate Printed board
13.Resistance to vibra- △L/L
tion WithinM5L
△L/L WithinM5L
△L/L WithinM10L
LER LEM LBYLBC
No significant abnormality in appearance. No significant abnormality in appearance.
According to JIS C5102 clause 8.2.
Vibration type
Q
R12V1R0
25min.
1R2V3R3
20min.
Directions 2 hrs each in X, Y and Z direc-
tions. Total 6 hrs
Frequency range 10 to 55 to 10 Hz f1min.g
Amplitude 1.5mm
Mounting method Soldering onto printed board
△L/L
f* Excluding 5N6-R10 LE
WithinM5L
Q
Seriesg
Recovery At least 1 hr of recovery under
the standard condition after the
test, followed by the measure-
ment within 2 hrs.
R12V100
30min.
120V220
20min.
203
4/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
14.Drop test
No significant △L/L WithinM5L
LERYLEM
△L/L
abnormality No significant abnormality in ap-
LER012YLER015
WithinM10L
No significant
abnormality
in appear-
ance.
in appear- pearance.
ance.
Drop test
Impact material concreta or vinyl tile
Height 1m
Total number of drops 10 times
5
LEM2520YLEMC2520YLEMF2520Y
LEMC3225YLEMF3225
Acceleration 980m/sec2
Duration 6msec
Number of times 6 sides P 3 times
Mounting method Soldering onto printed board
f* Excluding 10NVR10g
Recovery At least 1 hr of recovery under
the standard condition after the
test, followed by the measure-
ment within 2 hrs.
At least 90L of electrode
15.Solderability
LERYLEM
Solder temperature 230M5C
Duration 2M0.5sec. fLER012YLER015g
5M0.5sec. fLEM2520Y
LEMC2520YLEMF2520Y
LEMC3225YLEMF3225g
Fiux Methanol solution with 25L of
colophony
LBYLBH
Solder temperature 230M5C
Duration 5M0.5sec
Fiux Methanol solution with 25L of
colophony
205
5/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
Conduct following wave soldering twice.
16.Resisitance to
soldering heat
No significant abnormality in appearance
fLER012g
5
Solder temperature 260M5C
Duration 5M0.5sec. Twice fLERO15g
10M1sec. Once fLEM2520Y
LEMC2520YLEMF2520Y
LEMC3225YLEMF3225g
LBYLBH
3 times of reflow oven at 220 M 5C for
40sec.with peak temperature at 235M 5C
for 5sec.
No significant abnormality in appearance.
Solvent temperature Room temperature
Type of solvent Chlorocarbon type
fLEM2520YLEMC2520Y
LEMC3225g
17.Resisitance to
soolvent
Isopropyl alcohol
fLEMF2520YLEMF3225Y
LBYLBCg
Cleaning conditions Output 20mW/cm3
Frequency 28kHz
Duration 1 min
Conduct ultrasonic
cleaning.
fLEM2520YLEMC
2520YLEMC3225g
90s. Immersion and
cleaning.
fLEMF2520YLEMF
3225YLBYLBCg
207
6/8
RELIABILITY DATA
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
△L/L
△L/L
△L/L WithinM10L
Conditions for 1cycle
18.Resisitance to
solvent
△L/L
WithinM10L WithinM10L
Step TemperaturefCg
TemperaturefCg Durationfming
WithinM5L
△L/L
Q
Q
1
2
K25
J85
K40
J85
30
30
5N6V18N
10min.
10N 10min.
12NV33N
15min.
withinM0.5nH
under
22NVR10
15min.
Temperature for LER012YLER015
Temperature for
8.2
H
39NVR10
20min.
△Q/Q
5
R12V1R0
25min.
LEM2520YLEMC2520YLEMF2520Y
LEMC3225YLEMF3225
withinM20L
△Q/Q
R12V4R7
30min.
1R2V3R3
20min.
Number of cycle 100 cycle
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
within
5R6V330
25min.
M5 under
8.2
H
△L/L
390V 820
WithinM10L 20min.
Q
101 15min.
10NV18N
10min.
LBYLBCYLBH
K40VJ85C, miantain times 30min. ,100 cycle
Recovery At least 1 hr of recovery under
the standard condition after the
test, followed by the measure-
ment within 2 hrs.
22NVR10
15min.
R12V100
30min.
120V220
20min.
△L/L
△L/L
△L/L
△L/L WithinM10L
19.Damp heat
Temperature 60M2C
WithinM10L WithinM10L
WithinM5L
△L/L
Humidity 90V95LRH
Q
Q
Duration 1000 hrs
5R6V18N
10min.
10N 10min.
12NV33N
15min.
withinM0.5nH
under
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
22NVR10
15min.
8.2
H
39NVR10
20min.
△Q/Q
R12V1R0
25min.
WithinM20L
△Q/Q
R12V4R7
30min.
1R2V3R3
20min.
within
5R6V330
25min.
M5 under
8.2
H
△L/L
390V820
WithinM10L 20min.
Q
101 15min.
10NV18N
10min.
22NVR10
15min.
R12V100
30min.
120V220
209
7/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
LERYLEMYLBYLBC
△L/L
△L/L
△L/L WithinM10L
20.Loading under
damp heat
△L/L
Temperature 60M2C fExcluding nH rangeg
Humidity 90V95LRH
WithinM10L WithinM10L
WithinM5L
△L/L
Q
Q
Duration 1000 hrs
R12V1R0
25min.
1R2V3R3
20min.
R12V4R7
30min.
within
Applied current Rated current
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
0.5nH
under
5R6V330
25min.
8.2
H
5
390V820
20min.
△Q/Q
△L/L
withinM20L
△Q/Q
WithinM10L
Q
101 15min.
within
R12V100
30min.
M5 under
8.2
H
120V220
20min.
△L/L
△L/L
△L/L WithinM10L
LERYLEM
21.Hirh temperaturte
life test
WithinM10L
Q
WithinM10L
Q
Temperature 85M2C
Duration 1000 hrs
5R6V18N
10min.
10N 10min.
12NV33N
15min.
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
22NVR10
15min.
39NVR10
20min.
R12V1R0
25min.
R12V4R7
30min.
1R2V3R3
20min.
5R6V330
25min.
△L/L
390V820
20min.
WithinM10L
Q
101 15min.
10NV18N
10min.
22NVR10
15min.
R12V100
30min.
120V220
20min.
△L/L WithinM10L
△L/L
△L/L
LERYLBYLBC
22.Loading at high
temperature
WithinM5L
△L/L
WithinM10L
Q
Temperature 85M2C fExcluding nH rangeg
Duration 1000 hrs
withinM0.5nH
under
R12V1R0
25min.
Applied current Rated current
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
8.2
H
1R2V3R3
20min.
△Q/Q
WithinM20L
△Q/Q
△L/L
within
WithinM10L
Q
M0.5 under
8.2
H
R12V100
30min.
120V220
20min.
211
8/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
LB1608
LBC2518
LERYLEMYLBYLBCYLBH
23.Low temperature
life test
△L/L
△L/L
△L/L WithinM10L
△L/L
Temperature K40M2C
WithinM10L
Q
WithinM10L
Q
WithinM5L
△L/L
Duration 1000 hrs
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
10N 10min.
12NV33N
15min.
5R6V18N
10min.
withinM0.5nH
under
22NVR10
15min.
8.2
H
39NVR10
20min.
△Q/Q
5
R12V1R0
25min.
WithinM20L
△Q/Q
R12V4R7
30min.
1R2V3R3
20min.
within
5R6V330
25min.
M5 under
8.2
H
390V820
20min.
△L/L
M10L
101 15min.
Q
10NV18N
10min.
22NVR10
15min.
R12V100
30min.
120V220
20min.
24.Standard condition "Sutandard condition" referred to herein defined as follows
5
Standard test condition Unless oherwise
to 35 of temperature, 45 to 85% relative humidity, and 86 to specified,Temperature20M 15 of temperature,
106kPa of air pressure.When there are questions concerning 65M20L of relative humidity.When there are question
measurement results In order to provide correlation data, the concerning measurement result In order to provide cor-
test shall be conducted under condition of 20M2 of tempera- relation date, the test shall be condition of 20M2 of
ture, 45 to 85L to 106kPa of air pressure. Unless otherwise tenterature, 65M5L relative humidity.
specified all the test are conducted under the "standard condi- Inductance is in accordance with our measured value.
tion"
213
梱包ꢀPACKAGING
1標準数 Standard Quantity
ꢀꢀꢀꢀ
ꢀꢀꢀꢀꢀ標準数
Standard Quantity
チップ
Chip Cavity
A
ピッチ テープ
[pcs]
形ꢀꢀ式
形ꢀ式ꢀ
ꢀꢀꢀꢀꢀꢀꢀꢀ
Insertion Pitch
Tape Thickness
Type
Type
ꢀꢀꢀテーピング
B
F
K
T
LB2518
ꢀꢀꢀꢀꢀBulk / Bag
ꢀꢀꢀTape&Reel
ꢀ
ꢀ
ꢀ
ꢀ
2.15M0.1
2.7M0.1
4.0M0.1
2.1
0.3
LBC2518
f0.085M0.004g f0.107M0.004g f0.157M0.004g f0.083g f0.012g
LB2518 / LBC2518
LB2016
2000
2000
3000
4000
2000
2000
3000
4000
1.9M0.1
2.2M0.1
4.0M0.1
2.15
0.3
LB2016
LB2012
f0.075M0.004g f0.087M0.004g f0.157M0.004g f0.085g f0.012g
LB2012
1.5M0.2
2.3M0.2
4.0M0.1
2.0
0.3
LBH1608 / LB1608
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.079g f0.012g
1.1max 1.1max
5
LBH1608
LB1608
1.0M0.2
1.8M0.2
4.0M0.1
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.079g f0.012g
Unit: mm (inch)
2テーピング
Tape material
4リーダ
/
Leader and Blank Portion
5リール寸法 Reel Size
3テーピング寸法ꢀTaping Dimensions
エン ステープ 8mm Embossed Tape (0.315 inches wide)
テープ 8mm Paper tape (0.315 inches wide)
10M1.5
(0.394M0.059)
6
ップテープ
Top Tape Strength
方向にて0.2 0.7N
ップテープの
、
図
な
The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the
arrow as illustrated below.
197
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